Methods, systems, and apparatus for tape-frame substrate cleaning and drying

ABSTRACT

Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

FIELD

Embodiments of the present disclosure generally relate to methods,systems, and apparatus for processing substrates. More particularly,embodiments of the disclosure relate to methods, systems, and apparatusfor wet cleaning and drying of tape-frame substrates.

BACKGROUND

Substrates undergo various processes during the fabrication ofsemiconductor integrated circuit devices. Some of these processesinclude wafer (e.g., substrate) dicing, in which a processed wafer isplaced on a dicing tape and is cut or separated into a plurality of diesor chiplets. After dicing, cleaning of the front and backside of atape-frame wafer is performed such as with a pressurized nozzledispensing a fluid. Such cleaning is challenging due to the mechanicalfragility of thin dies and the small separation between them on thedicing tape. For example, the suspended dicing tape can vibrate and/ordeflect under a pressurized nozzle, creating particles and causing thindie breakage and damage.

Accordingly, the inventors have provided improved methods, systems, andapparatus for cleaning and drying tape-frame substrates.

SUMMARY

Methods, systems, and apparatus for processing tape-frame substrates areprovided herein. In some embodiments, an apparatus for supporting atape-frame substrate includes a chuck having a first side and a secondside opposite the first side, the first side having a convex surfaceconfigured to support the tape-frame substrate. Also, the apparatusincludes a plurality of channels extending through the chuck and havingoutlets along the first side. The plurality of channels are configuredto dispense fluid from the outlets along the convex surface of the firstside.

In some embodiments, a system for supporting a tape-frame substrateincludes a chuck having a first side and a second side opposite thefirst side, the first side having a convex surface configured to supportthe tape-frame substrate, and a plurality of channels extending throughthe chuck and having outlets along the first side. The plurality ofchannels are configured to dispense fluid from the outlets along theconvex surface of the first side. Also, the system includes a holderconfigured to mount a tape-frame substrate to the chuck. The pluralityof channels are configured to dispense fluid from the outlets anddischarge fluid between the tape-frame substrate and the convex surfaceof the chuck when the tape-frame substrate is mounted to the chuck.

A method of cleaning a tape-frame substrate includes mounting atape-frame substrate to a chuck. The chuck has a first side and a secondside opposite the first side. The first side has a convex surfaceconfigured to support the tape-frame substrate. The chuck has aplurality of channels extending through the chuck and have outlets alongthe first side. The tape-frame substrate has a dicing tape having afirst side and a second side and a plurality of substrates attached tothe first side of the dicing tape. Also, the method includes directing afirst fluid through the chuck and dispensing the first fluid out of theoutlets into a space between the convex surface and the second side ofthe dicing tape, and directing a second fluid onto the substrates from afluid source positioned facing the first side of the dicing tape.

Other and further embodiments of the present disclosure are describedbelow.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present disclosure, briefly summarized above anddiscussed in greater detail below, can be understood by reference to theillustrative embodiments of the disclosure depicted in the appendeddrawings. However, the appended drawings illustrate only typicalembodiments of the disclosure and are therefore not to be consideredlimiting of scope, for the disclosure may admit to other equallyeffective embodiments.

FIG. 1 is a schematic, sectional side view of a support system and atape-frame substrate in a first configuration, according to embodimentsof the disclosure.

FIG. 2 is a schematic, sectional side view of the support system and thetape-frame substrate of FIG. 1 in a second configuration used during acleaning and drying process of a second or back side of the tape-framesubstrate, according to embodiments of the disclosure.

FIG. 3 is a is a schematic sectional side view of the support system andthe tape-frame substrate of FIG. 1 in a third configuration during acleaning and drying process of a first or front side of the tape-framesubstrate, according to embodiments of the disclosure.

FIG. 4 a is a schematic sectional side view of the support system andtape-frame substrate of FIG. 3 in the third configuration with analternate chuck, according to embodiments of the disclosure.

FIG. 4 b is a schematic sectional side view of the support system andtape-frame substrate of FIG. 3 in the third configuration with analternate chuck, according to embodiments of the disclosure.

FIG. 5 is a schematic sectional side view of the support system andtape-frame substrate of FIG. 2 in the second configuration with analternate chuck, according to embodiments of the disclosure.

FIG. 6 is a schematic sectional side view of the support system andtape-frame substrate of FIG. 2 in the second configuration with analternate chuck, according to embodiments of the disclosure.

FIG. 7 is a schematic sectional side view of the support system andtape-frame substrate of FIG. 2 in the second configuration with analternate chuck, according to embodiments of the disclosure.

FIG. 8 is a schematic sectional side view of the support system andtape-frame substrate of FIG. 3 in the third configuration with analternate chuck, according to embodiments of the disclosure.

FIG. 9 is a schematic sectional side view of the support system andtape-frame substrate of FIG. 3 in the third configuration with analternate chuck, according to embodiments of the disclosure.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. The figures are not drawn to scale and may be simplifiedfor clarity. Elements and features of one embodiment may be beneficiallyincorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

Embodiments of a method, apparatus, and system for wet cleaning anddrying of tape-frame substrates are provided herein. The embodiments ofthe methods, systems, and apparatus described herein can improve dicinglane cleaning between substrates on a tape-frame substrate, reduceparticle generation, and mitigate thin die breakage during wet cleaningand drying of tape-frame substrates. Also, the embodiments of themethods, systems, and apparatus described herein may eliminate a need toflip or otherwise turn the tape-frame substrate over for cleaning anddrying both sides of the tape-frame substrate.

FIG. 1 is a schematic sectional side view of a support system 100according to embodiments of the present disclosure. The support system100 is configured to support a tape-frame substrate 200, such as duringwet cleaning and drying methods in accordance with the presentdisclosure.

The tape-frame substrate 200 may include a dicing tape 202, a pluralityof substrates 204 attached to the dicing tape 202, and a frame 206connected to the dicing tape 202. In embodiments, the dicing tape 202has elastic properties that allow the dicing tape to elastically deformduring wet cleaning and drying processes, as discussed in greater detailbelow. In embodiments, the dicing tape 202 may be commercially availabledicing tape, such as Series Q or G dicing tape commercially availablefrom Lintec Corporation, of Tokyo, Japan.

The dicing tape 202 has a front or first side 202 a and a back or secondside 202 b. The plurality of substrates 204 are attached to the front orfirst side 202 a of the dicing tape 202, such as with an adhesive. Thesubstrates 204 are spaced by dicing lanes 208. In some embodiments, theframe 206 surrounds the plurality of substrates 204. The frame 206 mayextend along or near an outer edge 202 c of the dicing tape 202. In someembodiments, the frame 206 is relatively rigid in comparison to thedicing tape 202, which is relatively flexible. In some embodiments theframe 206 may be formed of a metal, such as stainless steel.

As a result of dicing or other processing operations, particles 210, 212may be attached to the tape-frame substrate 200. Some particles 210 areshown in the dicing lanes 208 between adjacent substrates 204 and someparticles 212 are attached to the back or second side 202 b of thedicing tape 202, As discussed in greater detail below, embodiments ofwet cleaning and drying methods in accordance with the presentdisclosure may be employed to remove the particles 210, 212.

In FIG. 1 the support system 100 is shown in a first configuration wherethe tape-frame substrate 200 is not mounted to the support system 100.In the first configuration the dicing tape 202 is shown in a flat,undeformed configuration with the substrates 204 spaced apart by a widthW of the dicing lanes 208. A central axis A extends through the centerof the support system 100 and the tape-frame substrate 200. Eachsubstrate 204 extends parallel to the axis A from a base 204 a at thefirst side 202 a of the dicing tape 202 to a free end 204 b spacedaxially from the base 204 a. As used herein, “axial” or “axially” refersto a direction along or parallel to axis A. In the flat configuration ofthe dicing tape 202 shown in FIG. 1 , the width W of each dicing lane208 is relatively constant along the axial direction.

The support system 100 includes a chuck 102 and a holder 104. In someembodiments, the chuck 102 is an upper portion of a pedestal 103, whichmay be configured to rotate about axis A with the chuck 102, The chuck102 has a first or front side 102 a and a second or back side 102 bopposite the first side 102 a. The central axis A extends through thecenter of the chuck 102 between the first side 102 a and the second side102 b. In embodiments, as shown in FIG. 1 , the tape-frame substrate 200is configured to coaxially align with the chuck 102.

The first side 102 a of the chuck 102 has a convex surface 106configured to support the tape-frame substrate 200 in a thirdconfiguration, such as shown, for example, in FIG. 3 . Specifically, theconvex surface 106 is configured to elastically deform the dicing tape202 of the tape-frame substrate 200, as discussed in greater detailbelow. The convex surface 106 has a peak at a center 106 a and an outeredge 106 b. In embodiments, the convex surface 106 is axisymmetric aboutaxis A.

Also, the chuck 102 has a plurality of channels 108 extending throughthe chuck 102 and having outlets 110 along the first side 102 a. Inembodiments, the channels 108 extend from the first side 102 a to thesecond side 102 b. The channels 108 may fluidly couple to fluid channels105 in the pedestal 103. The plurality of channels 108 are configured todispense fluid from the outlets 110 along the convex surface 106 of thefirst side 102 a of the chuck 102. In some embodiments, the fluid isdispensed as a laminar flow outflow along the convex surface 106 fromthe center 106 a to the outer edge 106 b of the convex surface 106.

The cross-sectional area of the channels 108 and/or outlets 110 may besized based on the cross-sectional area of the substrates 204 of thedicing tape 202. For example, in some embodiments the outlets 110 mayhave a cross-sectional area that is less than a cross-sectional area ofa respective substrate 204 aligned with the outlet 110 along a directionparallel with the central axis A, which may ensure the substrates 204are adequately supported by the convex surface 106 to reduce bendingstress or breakage of the substrates during cleaning and drying.

The holder 104 is configured to removably mount the tape-frame substrate200 to the chuck 102. The holder 104 includes fingers 112 that areconfigured to engage the frame 206 of the tape-frame substrate 200, asshown in FIGS. 2 and 3 , to retain the tape-frame substrate 200 relativeto the chuck 102 in either of the second or third configurations. Insome embodiments, such as that shown in FIG. 2 , the holder 104 may beconfigured as a “soft lock” that is biased to permit an amount oflimited relative movement in the axial direction between the frame 206and the chuck 102 as discussed in greater detail below.

In some embodiments, the frame 206 is circular and the holders 104 arearranged in spaced relation to one another around the circular frame206. Also, in some embodiments, the chuck 102 and the holder 104 areconfigured to rotate together about the central axis A with or withoutthe tape-frame substrate 200 being mounted to the chuck 102. Suchrotation may be utilized during washing or drying of the tape-framesubstrate 200.

In some embodiments, the support system 100 may also include lockingscrews 116 configured to secure the tape-frame substrate 200 at cuts 214(two cuts formed in commercially available frames 206) formed in theframe 206 of the tape frame substrate 200. In some embodiments thelocking screws 116 extend from the pedestal 103 to the frame 206. Thelocking screws 116 are configured to prevent relative rotation betweenthe support system 100 and the tape-frame substrate 200 during rotationof the tape-frame substrate 200 and the support system 100 about thecentral axis A.

FIG. 2 is a schematic sectional side view of the tape-frame substrate200 mounted to the support system 100 in a second configuration for acleaning and/or drying process of the back or second side 202 b of thedicing tape 202, according to embodiments of the present disclosure. Inthe embodiment shown in FIG. 2 , the tape-frame substrate 200 is mountedto the chuck 102 in alignment with the central axis A. The fingers 112of the holder 104 engage the frame 206 of the tape-frame substrate 200so that the tape-frame substrate is retained relative to the chuck 102.

As noted above, in some embodiments, the holder 104 may be configured topermit a slight axial displacement of the holder 104 and, consequently,of the tape-frame substrate during cleaning. For example, during acleaning process of the second side 202 b of the dicing tape 202 shownin FIG. 2 , the holder 104 may retain the frame 206 of the tape-framesubstrate 200 so that the dicing tape 202 initially contacts andelastically deforms around the convex surface 106, so that the dicingtape 202 and the system assume the third configuration shown in FIG. 3 .Nevertheless, during a wet cleaning or drying method of the second side202 b of the dicing tape 202, a liquid (e.g., deionized water orpressurized gas) is directed through the channels 108 to the outlets 110between the second side of the dicing tape 202 and the convex surface106. The dispensed fluid may exert fluid pressure on the dicing tape 202to overcome the bias of the soft lock feature of the holder 104 and theweight of the tape-frame substrate 200 to cause the entire tape-framesubstrate 200 to lift slightly off the convex surface 106 due to thesoft lock feature of the holder 104, thus assuming the secondconfiguration of the tape-frame substrate 200 and system 100 shown inFIG. 2 . The dispensed fluid may have a pressure of 50 psi to 1000 psi.

In addition to lifting the tape-frame substrate 200, the fluid pressurecauses elastic deformation of the dicing tape 202. As shown in FIG. 2 ,the fluid pressure causes the dicing tape 202 to elastically deform witha curvature corresponding to the curvature of the convex surface 106.Thus, in the second configuration, the fluid acts as a layer that cansupport the tape-frame substrate 200 and elastically deform the dicingtape 202.

In the second configuration shown in FIG. 2 , the fluid flows outwardfrom the center 106 a to the outer edge 106 b of the convex surface 106between the second side 202 b of the dicing tape 202 and the convexsurface 106. The channels 108 and the outlets 110 are configured toproduce flow of the fluid under a laminar flow regime along the convexsurface 106 to facilitate flushing of the particles 212 attached to thesecond side 202 b of the dicing tape 202.

The elastic deformation of the dicing tape 202 caused by the fluidpressure causes the substrates 204 to splay, thereby increasing thewidth of the dicing lanes 208 in the axial direction. That is, the widthof the dicing lanes 208 between the free ends 204 b of adjacentsubstrates 204 is larger than the width between the bases 204 a ofadjacent substrates 204. In some embodiments, fluid is dispensed fromthe outlets 110 to elastically deform the dicing tape 202 to maintainuniform dicing lanes 208 over the dicing tape 202. As discussed ingreater detail below, various parameters, such as channel density,outlet size, shapes, and angle, and outflow pressure may be selected oradjusted to achieve uniform elastic deformation of the dicing tape 202to maintain uniform dicing lanes 208 of the dicing tape 202.

Moreover, the elastic deformation of the dicing tape 202 can reducevibration of the tape-frame substrate 200 when the dicing tape 202 isimpinged by the fluid during cleaning or drying. The increased spacingbetween the free ends 204 b of the substrates 204 and the reducedvibration of the tape-frame substrate can reduce edge rubbing andbreakage of the substrates 204 during cleaning and drying of the secondside 202 b of the dicing tape 202.

As noted above, the arrangement shown in FIG. 2 may be used for wetcleaning and drying the second side 202 b of the dicing tape 202. Duringwet cleaning the fluid may be deionized water, while during drying, thefluid may be a pressurized gas, such as nitrogen. Also, in embodiments,during wet cleaning or drying, the mounted tape-frame substrate 200 maybe rotated in unison with the support system 100 about the central axisA while the pressurized gas flows through the channels 108 and isdispensed out the outlets 110 in the space between the convex surface106 and the second side 202 b of the dicing tape 202.

FIG. 3 is a is a schematic sectional side view of the support system andthe tape-frame substrate of FIG. 1 in a third configuration during acleaning and drying process of a first or front side of the tape-framesubstrate, according to embodiments of the present disclosure. FIG. 3shows the tape-frame substrate 200 mounted to the chuck 102 in a thirdconfiguration for cleaning and drying, in accordance with embodiments ofthe present disclosure. In the third configuration, the holder 104retains the frame 206 of the tape-frame substrate 200 so that the dicingtape 202 engages and elastically deforms about the convex surface 106 ofthe chuck 102. In embodiments, the convex surface 106 makes uniformcontact with the dicing tape 202 and conforms to the convex surface 106.As a result of the elastic deformation of the dicing tape 202, thesubstrates 204 splay so that the width of the dicing lanes 208 increasein the axial direction, in similar fashion to that described above inthe second configuration. Thus, the width of the dicing lanes 208 islarger at the outer edges 204 b of the substrates 204 than at the bases204 a. The increased width of the dicing lanes 208 exposes the particles210 in the dicing lanes 208 to facilitate flushing of the particles 210.

In the embodiment shown in FIG. 3 , a swinging or otherwise movablefluid source (e.g., a nozzle) 300 may be used to dispense pressurizedfluid (e.g., liquid or gas) onto the substrates 204 and the first side202 a of the dicing tape 202 and into the dicing lanes 208. Thedispensed pressurized fluid may have a pressure of 50 psi to 1000 psi.The fluid source 300 is positioned facing the first side 202 a of thedicing tape 202. During cleaning, high-pressure liquid is dispensed fromthe fluid source 300 and directed into the expanded dicing lanes 208 toflush out the particles 210. During drying, a pressurized gas may bedispensed from the fluid source 300 to dry the substrates 204 and thefirst side 202 a of the dicing tape 202, including the dicing lanes 208.

Cleaning and drying of the tape-frame substrate 200 in the thirdconfiguration can stabilize the dicing tape 202 and the substrates 204to limit the substrates 204 from rubbing, breaking, and generatingparticles. Due to straining of the dicing tape 202 against the convexsurface 106 of the chuck 102, the tape-frame substrate may experiencelittle vibration or deflection (apart of compression of the dicing tape202 discussed below) during cleaning or drying of the substrates 204 andthe first side 202 a of the dicing tape 202, thereby limiting the chanceof the substrates 204 rubbing, breaking, and generating particles duringcleaning and drying. Moreover, the increased width of the dicing lanes208 caused by the splaying of the substrates 204 in the thirdconfiguration can also reduce rubbing and breaking of substrates duringcleaning and drying. The reduction in vibration and increased dicinglane width may, thus, permit the use of high-impact cleaning (mist, jet,etc.) as well as pressurized gas-assisted drying of the dies without anincreased risk of the substrates rubbing, breaking, and generatingparticles.

In addition to being elastic, the dicing tape 202 may be slightlycompressible in the axial direction. Thus, it is possible in the thirdconfiguration that the dicing tape 202 may compress and deflect slightlytowards the chuck 102 when the tape-frame substrate 200 is locallyimpinged by fluid dispensed from the fluid source 300. Nevertheless, theconvex surface 106 may be designed to have a sufficient convex curvatureto ensure that the widths of the dicing lanes 208 remain open to preventedge rubbing of adjacent substrates 204 even if the dicing tape 202 islocally compressed by fluid dispensed by the nozzle 300.

Thus, the embodiments of the methods, systems, and apparatus describedherein can improve dicing lane cleaning, reduce particle generation, andmitigate thin die breakage during wet cleaning and drying of tape-framesubstrates. Also, the embodiments of the methods, systems, and apparatusdescribed herein may eliminate a need to flip or otherwise turn thetape-frame substrate over for cleaning and drying both sides of thetape-frame substrate.

As noted above, the convex surface 106 of the chuck 102 is configured toprovide support for the tape frame substrate 200. The convex surface 106may have various configurations and dimensions. In embodiments, theconvex surface 106 at least projects onto an area occupied by thesubstrates 204 to support the substrates 204 in the axial direction. Forexample, in the embodiment shown in FIG. 1 , the outer edge 106 b of theconvex surface 106 extends radially with respect to axis A to the outeredge 202 c of the dicing tape 202 so that the entire dicing tape 202 canmake contact with and be supported by the convex surface 106 in thethird configuration. In some alternate embodiments, such as that shownin FIG. 4 a , the outer edge 106 b of the convex surface 106 extends toan outer boundary B of an area occupied by the substrates 204. Also, insome embodiments, such as that shown in FIG. 4 b , the outer edge 106 bof the convex surface 106 extends between the outer boundary B and theframe 206.

In embodiments, the convex surface has a peak at center 106 a andextends to the outer edge 106 b. In embodiments, a height of the convexsurface, measured as an axial distance between the peak and the outeredge, is up to about 16 mm. Such dimensions allow the convex surface 106to sufficiently elastically deform the dicing tape 202 in the thirdconfiguration without causing damage to the dicing tape 202 or thesubstrates 204. In embodiments, the height of the convex surface 106 maybe based on the amount of the area of the tape frame substrate 200supported by the convex surface 106. For example, in the embodimentshown in FIG. 1 , the height of the convex surface 106 may be up toabout 16 mm. In the embodiment shown in FIG. 4 a , the height of theconvex surface 106 may be up to about 10 mm.

In embodiments, at least one of channel density (number of channels perunit area), channel size, channel shape, channel outflow angle, oroutflow pressure may be selected to provide a uniform fluid pressureunder all substrates 204 to maintain uniform shape of the dicing lanes208 over the entire tape-frame substrate 200. Also, in embodiments, atleast one of channel density, channel size, channel shape, channeloutflow angle, or outflow pressure may be selected to permit a highradial fluid flow rate for better cleaning and drying efficiency, withor without the assistance of rotating the tape-frame substrate 200during cleaning or drying. Moreover, in embodiments, at least one ofchannel density, channel size, or channel shape may be selected toprovide a smooth convex surface with minimum opening hole size so thatthin substrates 204 experience less warping/bowing on the outlets 110during high pressure cleaning and drying of the substrates 204 and firstside 202 a of the dicing tape 202.

In the embodiments shown in FIGS. 1 to 3 , the density of the channels108 and their outlets 110 on the convex surface 106 is uniformthroughout the convex surface 106. In some embodiments, such as thatshown in FIG. 5 , the density of the channels 108 and the outlets 110may vary throughout the convex surface 106. For example, as shown inFIG. 5 , the density of channels 108 and the outlets 110 is highertowards the central axis A than at the outer edge 106 b of the convexsurface 106. In some embodiments, the density of outlets may be 1 to 25outlets per square centimeter of the convex surface 106.

Also, the outlets 110 may have the same or different sizes (e.g.,diameters). In the embodiment of the chuck 102 shown in FIGS. 1-3 , theoutlets 110 have the same sizes. In the embodiment of the chuck 102shown in FIG. 6 , the outlets 110 have different diameters, with largerdiameter outlets 110 being located radially closer to the central axis Aand smaller diameter outlets 110 being located radially further from thecentral axis A. In embodiments, the outlets may have a diameter of about0.5 mm to 3 mm.

The outlets 110 may be directed in the same or different directions. Forexample, in the embodiments shown in FIGS. 1-3 , all of the outlets 110are directed parallel to each other and to the central axis A. However,in the embodiment shown in FIG. 7 , the outlets 110 are directed atdifferent angles that are non-parallel with respect to the central axisA.

In the embodiments shown in FIGS. 1-3 , the channels 108 and outlets 110are fully open. In some embodiments, such as shown in FIGS. 8 and 9 ,one or more of the channels 108 and outlets 110 may have an actuatableflow control element (e.g., a valve) to independently control flowthrough the channels 108 and outlets 110.

For example, FIGS. 8 and 9 show an embodiment of a chuck 102 thatincludes a plurality of valves 130. In FIGS. 8 and 9 each valve 130corresponds to one channel 108. Each valve 130 has a head 132 and a stem134 extending from the head 132. The head 132 is configured to seal witha valve seat 136 formed in the convex surface 106 so that a face 132 aof the head 132 is substantially flush with the convex surface 106. Incomparison to the open outlets 110 of the embodiments shown in FIGS. 1-3, the flush faces 132 a of the heads 132 of the valves 130 may provideadditional support for the substrates 204 of the tape-frame substrate200 during cleaning and drying operations when the tape-frame substrate200 is in the third configuration, as shown in FIG. 9 . A smootherconvex surface 106 with fewer or smaller open outlets 110 may bebeneficial to reduce warping/bowing of thin dies supported on thechannel outlets 110 during high pressure cleaning and drying of thetape-frame substrates 200 when mounted in the third configuration.

In embodiments, the stem 134 of each valve 130 extends through thecorresponding channel 108 beyond the second side 102 b of the chuck 102and may be connected to a stop 138. The stop 138 is configured to limitthe axial displacement of the valve 130 with respect to the chuck 102.In embodiments, a biasing element, such as a spring (not shown), may beconnected between the stop 138 and the second side 102 b of the chuck102 to bias the head 132 of the valve 130 into a closed or sealedposition with the valve seat 136, as shown in FIG. 9 .

As shown in FIG. 8 , during a cleaning or drying operation of the secondside 202 b of the dicing tape 202, the valves 130 may be opened byflowing fluid through the channels 108 to the first side 102 a of thechuck 102 at a sufficient pressure to counter the weight of the valve130 and/or bias on the valves 130. In FIG. 8 , when the valves 130 areopened by the flowing fluid, the heads 132 of valves 130 remain spacedfrom the second side 202 b of the dicing tape 202.

While the foregoing is directed to embodiments of the presentdisclosure, other and further embodiments of the disclosure may bedevised without departing from the basic scope thereof.

The invention claimed is:
 1. An apparatus for supporting a tape-framesubstrate, the apparatus comprising: a chuck having a first side and asecond side opposite the first side, the first side having a convexsurface configured to support the tape-frame substrate; a plurality ofchannels extending through the chuck and having outlets along the firstside, wherein the plurality of channels are configured to dispense fluidfrom the outlets along the convex surface of the first side; and aplurality of valves coupled to the chuck, wherein each valve correspondsto one channel of the plurality of channels, wherein each valve isconfigured to open when fluid is flowing through the channel and closewhen fluid is not flowing through the channel, wherein each valve isdisposed at the outlet, and wherein in a closed position the valve issubstantially flush with the convex surface.
 2. The apparatus accordingto claim 1, wherein the convex surface is centered about a central axisextending through the chuck, the convex surface extending from a peak ata center of the chuck to an outer edge of the chuck, and wherein theconvex surface has a height measured along the central axis between thepeak to the outer edge, wherein the height is less than about 16 mm. 3.The apparatus according to claim 1, wherein a density of the outlets is1 to 25 outlets per square centimeter.
 4. The apparatus according toclaim 1, wherein the outlets have a diameter of about 0.5 mm-3 mm. 5.The apparatus according to claim 1, wherein the outlets are configuredto direct fluid at a plurality of different angles relative to a centralaxis extending through the chuck.
 6. A system for supporting atape-frame substrate, the system comprising: a chuck having a first sideand a second side opposite the first side, the first side having aconvex surface configured to support the tape-frame substrate; aplurality of channels extending through the chuck and having outletsalong the first side, wherein the plurality of channels are configuredto dispense fluid from the outlets along the convex surface of the firstside; a plurality of valves coupled to the chuck; and a holderconfigured to mount a tape-frame substrate to the chuck, wherein theplurality of channels are configured to dispense fluid from the outletsand between the tape-frame substrate and the convex surface of the chuckwhen the tape-frame substrate is mounted to the chuck, wherein eachvalve corresponds to one channel of the plurality of channels, whereineach valve is configured to open when fluid is flowing through thechannel and close when fluid is not flowing through the channel, whereineach valve is disposed at the outlet, and wherein in a closed positionthe valve is substantially flush with the convex surface.
 7. The systemaccording to claim 6, wherein the convex surface is centered about acentral axis through the chuck, the convex surface extending from a peakat a center of the chuck to an outer edge of the chuck, wherein theconvex surface has a height measured along the central axis from a peakto an outer edge of less than about 16 mm.
 8. The system according toclaim 7, wherein the holder is configured to permit limited relativemovement along the central axis between the convex surface and thetape-frame substrate.
 9. The system according to claim 7, wherein thechuck and the tape-frame substrate and the holder are configured torotate together about the central axis.
 10. The system according toclaim 6, wherein a density of the outlets is 1 to 25 outlets per squarecentimeter.
 11. The system according to claim 6, wherein the outletshave a diameter of about 0.5 mm-3 mm.